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wideband 4 ghz, 36 db isolation at 1 ghz, cmos, 1.65 v to 2.75 v, dual spdt adg936/adg936-r rev. a information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ? 2005 analog devices, inc. all rights reserved. features wideband switch: ?3 db @ 4 ghz adg936 absorptive dual spdt adg936-r reflective dual spdt high off isolation (36 db @ 1 ghz) low insertion loss (0.9 db dc to 1 ghz) single 1.65 v to 2.75 v power supply cmos/lvttl control logic 20-lead tssop and 4 mm 4 mm lfcsp packages low power consumption (1 a maximum) applications wireless communications general-purpose rf switching dual-band applications high speed filter selection digital transceiver front end switch if switching tuner modules antenna diversity switching functional block diagrams inb rf1b rf2b rfcb adg936 ina rf1a rf2a rfca 50 50 50 50 04503-001 ina inb rf1a rf2a rf1b rf2b rfcb rfca adg936-r 04503-012 figure 1. figure 2. general description the adg936/adg936-r are wideband analog switches that comprise two independently selectable spdt switches using a cmos process to provide high isolation and low insertion loss to 1 ghz. the adg936 is an absorptive/matched dual spdt with 50 terminated shunt legs; the adg936-r is a reflective dual spdt. these devices are designed such that the isolation is high over the dc to 1 ghz frequency range. they have on-board cmos control logic, eliminating the need for external controlling circuitry. the control inputs are both cmos and lvttl compatible. the low power consumption of these cmos devices makes them ideally suited for wireless applications and general-purpose high frequency switching. product highlights 1. C36 db off isolation @ 1 ghz. 2. 0.9 db insertion loss @ 1 ghz. 3. 20-lead tssop and 4 mm 4 mm lfcsp packages. 04503-027 frequency (hz) 10g 10k 100k 1m 10m 100m 1g off isolation (db) ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 s12 s21 v dd = 2.5v t a = 25c figure 3. off isol ation vs. frequency 04503-015 frequency (hz) 10g 10k 100k 1m 10m 100m 1g insertion loss (db) ?0.3 ?0.4 ?0.5 ?0.6 ?0.7 ?0.8 ?0.9 ?1.0 ?1.1 ?1.2 ?1.3 ?1.4 ?1.5 ?1.6 ?1.7 ?1.8 ?1.9 ?2.0 ?2.1 ?2.2 ?2.3 ?2.4 ?2.5 ?2.6 ?2.7 ?2.8 ?2.9 ?3.0 v dd = 2.5v t a = 25c figure 4. insertion loss vs. frequency
adg936/adg936-r rev. a | page 2 of 16 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagrams ............................................................. 1 general description ......................................................................... 1 product highlights ........................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 absolute maximum ratings ............................................................ 4 esd caution .................................................................................. 4 pin configurations and function descriptions ........................... 5 ter mi nolo g y ...................................................................................... 6 typical performance characteristics ..............................................7 test circ u its ........................................................................................9 applications ..................................................................................... 11 absorptive vs. reflective ........................................................... 11 filter selection ............................................................................ 11 tx/rx switching ......................................................................... 11 antenna diversity switch .......................................................... 11 evaluation board ............................................................................ 12 outline dimensions ....................................................................... 13 ordering guide .......................................................................... 14 revision history 8/05rev. 0 to rev. a changes to table 1............................................................................ 3 changes to figure 6.......................................................................... 5 changes to ordering guide .......................................................... 14 7/04revision 0: initial version
adg936/adg936-r rev. a | page 3 of 16 specifications v dd = 1.65 v to 2.75 v, gnd = 0 v, input power = 0 dbm, all specifications t min to t max , unless otherwise noted. 1 table 1. b version parameter symbol conditions min typ 2 max unit ac electrical characteristics operating frequency 3 dc 2 ghz 3 db frequency 4 4 ghz input power 4 0 v dc bias 7 dbm 0.5 v dc bias 16 dbm insertion loss s 21 , s 12 dc to 100 mhz; v dd = 2.5 v 10% 0.4 0.5 db 500 mhz; v dd = 2.5 v 10% 0.6 0.8 db 1000 mhz; v dd = 2.5 v 10% 0.9 1.25 db isolationrfcx to rf1x/rf2x s 21 , s 12 100 mhz 52 60 db 500 mhz 40 47 db 1000 mhz 31 36 db crosstalkrf1x to rf2x s 21 , s 12 100 mhz 53 69 db 500 mhz 42 45 db 1000 mhz 34 37 db return loss (on channel) 4 s 11 , s 22 dc to 100 mhz 20 25 db 500 mhz 19 23 db 1000 mhz 16 24 db return loss (off channel) 4 s 11 , s 22 dc to 100 mhz 18 24 db 500 mhz 17 23 db 1000 mhz 16 21 db on switching time 4 t on 50% ctrl to 90% rf 11 14 ns off switching time 4 t off 50% ctrl to 10% rf 10 13 ns rise time 4 t rise 10% to 90% rf 6.1 8 ns fall time 4 t fall 90% to 10% rf 6 8 ns 1 db compression 4 p C1 db b 1000 mhz 16 dbm third-order intermodulation intercept ip 3 900 mhz/901 mhz, 4 dbm 27.5 32 dbm video feedthrough 5 3 mv p-p dc electrical characteristics input high voltage v inh v dd = 2.25 v to 2.75 v 1.7 v v inh v dd = 1.65 v to 1.95 v 0.65 v cc v input low voltage v inl v dd = 2.25 v to 2.75 v 0.7 v v inl v dd = 1.65 v to 1.95 v 0.35 v cc v input leakage current i i 0 v in 2.75 v 0.1 1 a capacitance 4 rf port on capacitance c rf on f = 1 mhz 2.5 pf digital input capacitance c dig f = 1 mhz 2 pf power requirements v dd 1.65 2.75 v quiescent power supply current i dd digital inputs = 0 v or v dd 0.1 1 a 1 temperature range of b version: ?40c to +85c. 2 typical values are at v dd = 2.5 v and 25c, unless otherwise noted. 3 operating frequency is the point at which insertion loss degrades by 1 db. 4 guaranteed by design, not subject to production test. 5 video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or from low to high in a 50 test setup, measured with 1 ns rise time pulses and a 500 mhz bandwidth.
adg936/adg936-r rev. a | page 4 of 16 absolute maximum ratings t a = 25c, unless otherwise noted. table 2. parameter rating v dd to gnd C0.5 v to +4 v inputs to gnd C0.5 v to v dd + 0.3 v 1 continuous current 30 ma input power 18 dbm operating temperature range industrial (b version) C40c to +85c storage temperature range C65c to +150c junction temperature 150c tssop package ja thermal impedance 143c/w lfcsp package ja thermal impedance (4-layer board) 30.4c/w lead temperature, soldering (10 sec) 300c ir reflow, peak temperature (<20 sec) 235c esd 1 kv stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. only one absolute maximum rating may be applied at any one time. table 3. truth table inx rf1x rf2x 0 off on 1 on off 1 rf1x/rf2x off port inputs to ground = C0.5 v to v dd C 0.5 v. esd caution esd (electrostatic discharge) sensitive device. electros tatic charges as high as 4000 v readily accumulate on the human body and test equipment and can discharge without detection. although this product features proprietary esd protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. therefore, proper esd precautions are recommended to avoid performance degradation or loss of functionality.
adg936/adg936-r rev. a | page 5 of 16 pin configurations and function descriptions 1 2 3 4 5 6 7 8 20 19 18 17 16 15 14 13 v dd gnd rf1a gnd gnd rf1b gnd gnd ina gnd rf2a gnd gnd rf2b gnd adg936 adg936-r top view (not to scale) rfc a 9 10 12 11 gnd rfcb inb gnd 04503-002 15 gnd notes 1. exposed pad tied to substate, gnd. 14 rf2a 13 gnd 12 gnd gnd 1 rf1a 2 gnd 3 gnd 6 gnd 7 rfcb 8 gnd 9 gnd 4 20 gnd 18 rfc a 17 gnd 19 v dd adg936 adg936-r top view (not to scale) inb 10 16 ina 11 rf2b rf1b 5 04503-003 figure 5. 20-lead tssop (ru-20) figure 6. 20-lead 4 mm 4 mm lfcsp (cp-20-1) table 4. pin function descriptions pin no. 20-lead tssop 20-lead lfcsp mnemonic description 1 18 rfca common rf port for switch a. 2 19 v dd power supply input. these parts can operate from 1.65 v to 2.75 v. v dd should be decoupled to gnd. 3, 5, 6, 8, 9, 11, 13, 15, 16, 18, 20 1, 3, 4, 6, 7, 9, 12, 13, 15, 17, 20 gnd ground reference point for all circuitry on the part. 4 2 rf1a rf1a port. 7 5 rf1b rf1b port. 10 8 rfcb common rf port for switch b. 12 10 inb logic control input. 14 11 rf2b rf2b port. 17 14 rf2a rf2a port. 19 16 ina logic control input.
adg936/adg936-r rev. a | page 6 of 16 terminology table 5. parameter description v dd most positive power supply potential. i dd positive supply current. gnd ground (0 v) reference. inx logic control input. v inl maximum input voltage for logic 0. v inh minimum input voltage for logic 1. i inl (i inh ) input current of the digital input. c in digital input capacitance. t on delay between applying the digital control input and the output switching on. t off delay between applying the digital cont rol input and the output switching off. t rise rise time. time for the rf signal to rise from 10% of the on level to 90% of the on level. t fall fall time. time for the rf signal to fall from 90% of the on level to 10% of the on level. off isolation the attenuation between input and output ports of the sw itch when the switch control voltage is in the off condition. insertion loss the attenuation between input and output ports of the sw itch when the switch control voltage is in the on condition. crosstalk measure of unwanted signal coupled through from on e channel to another as a result of parasitic capacitance. p C1 db b 1 db compression point. the rf input power level at which the switch insertion loss increases by 1 db over its low level value. p C1 db is a measure of how much power the on switch can handle before the insertion loss increases by 1 db. ip 3 third-order intermodulation intercept. this is a measure of the power in false tones that occurs when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. return loss the amount of reflected power relative to the incident po wer at a port. large return loss indicates good matching. by measuring return loss, the voltage standing wave ratio (v swr) can be calculated from conversion charts. vswr indicates the degree of matching present at a switch rf port. video feedthrough spurious signals present at the rf ports of the switch when the control voltage is switched from high to low or from low to high without an rf signal present.
adg936/adg936-r rev. a | page 7 of 16 typical performance characteristics 04503-015 frequency (hz) 10g 10k 100k 1m 10m 100m 1g insertion loss (db) ?0.3 ?0.4 ?0.5 ?0.6 ?0.7 ?0.8 ?0.9 ?1.0 ?1.1 ?1.2 ?1.3 ?1.4 ?1.5 ?1.6 ?1.7 ?1.8 ?1.9 ?2.0 ?2.1 ?2.2 ?2.3 ?2.4 ?2.5 ?2.6 ?2.7 ?2.8 ?2.9 ?3.0 v dd = 2.25v v dd = 2.50v v dd = 2.75v t a = 25c figure 7. insertion loss vs. frequency over supplies (s12 and s21) 04503-016 frequency (hz) 10g 10k 100k 1m 10m 100m 1g insertion loss (db) ?0.3 ?0.5 ?0.4 ?0.6 ?0.7 ?0.8 ?0.9 ?1.0 v dd = 2.25v v dd = 2.50v v dd = 2.75v t a = 25c figure 8. insertion loss vs. frequency over supplies (s12 and s21) (zoomed figure 7 ) frequency (hz) 10g 10k 100k 1m 10m 100m 1g insertion loss (db) ?0.3 ?0.8 ?0.7 ?0.6 ?0.5 ?0.4 ?1.2 ?1.1 ?1.0 ?0.9 ?1.7 ?2.2 ?2.1 ?2.0 ?1.9 ?1.8 ?1.6 ?1.5 ?1.4 ?1.3 ?2.3 ?2.4 ?2.5 ?2.6 ?2.7 ?2.9 ?2.8 ?3.0 v dd = 1.65v v dd = 1.80v v dd = 1.95v t a = 25c 04503-017 figure 9. insertion loss vs. frequency over supplies (s12 and s21) 04503-018 frequency (hz) 10g 10k 100k 1m 10m 100m 1g insertion loss (db) ?0.3 ?0.8 ?0.7 ?0.6 ?0.5 ?0.4 ?1.2 ?1.1 ?1.0 ?0.9 ?1.7 ?2.2 ?2.1 ?2.0 ?1.9 ?1.8 ?1.6 ?1.5 ?1.4 ?1.3 ?2.3 ?2.4 ?2.5 ?2.6 ?2.7 ?2.9 ?2.8 ?3.0 v dd = 2.5v t a = ?40c t a = +25c t a = +85c figure 10. insertion loss vs. frequency over temperature (s12 and s21) 04503-019 frequency (hz) 10g 10k 100k 1m 10m 100m 1g off isolation (db) ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 s12 s21 v dd = 1.65v to 2.75v t a = 25c figure 11. isolation vs. frequency over supplies 04503-020 frequency (hz) 10g 1g 10k 100k 1m 10m 100m off isolation (db) ?10 ?30 ?20 ?50 ?40 ?70 ?60 ?90 ?80 ?100 ?110 t a = ?40c t a = +85c t a = +25c v dd = 2.5v figure 12. isolation vs. frequency over temperature
adg936/adg936-r rev. a | page 8 of 16 04503-021 frequency (hz) 10g 10k 100k 1m 10m 100m 1g return loss (db) 0 ?5 ?10 ?15 ?20 ?25 ?30 v dd = 2.5v t a = 25c off switch on switch figure 13. return loss vs. frequency ( s11) 04503-022 frequency (hz) 10g 10k 100k 1m 10m 100m 1g crosstalk (db) ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90 v dd = 2.5v t a = 25c figure 14. crosstalk vs. frequency (s12 and s21) 04503-023 t [] ch1 ch2 5.00ns ch3 1.00v 100mv 100mv 1 3 tek run: 5.00gs/s et envelope inx rfx figure 15. switch timing 04503-024 ch3 1.00mv ch1 1.00v 20.0ns : 2.20mv 1 3 t tek run [] rfcx inx t trig'd figure 16. video feedthrough 04503-028 frequency (mhz) 900 100 200 300 400 500 600 700 800 ip 3 (db) 35 30 25 20 15 10 5 0 v dd = 2.5v t a = 25c figure 17. ip 3 vs. frequency 04503-025 frequency (mhz) 1500 0 250 500 750 1000 1250 p ?1db (dbm) 18 14 16 12 10 6 8 2 4 0 v dd = 2.5v t a = 25c figure 18. p C1 db vs. frequency
adg936/adg936-r rev. a | page 9 of 16 test circuits similar setup for the adg936. additional pins omitted for clarity. t on 50% 50% 90% 10% v inx v out t off 10 f v s inx rfx rfcx r l 50 v out gnd v dd v dd 04503-004 figure 19. switch timing: t on , t off v inx v out 50% 50% 90% 90% 10% 10% t fall t rise v dd v dd 10 f v s inx rfx rfcx gnd r l 50 v out 04503-005 figure 20. switch timing: t rise , t fall v s network analyzer v inx off isolation = 20log v out v s v dd 10 f v dd 50 v out r l 50 adg936-r rf2x rf1x inx rfc gnd 50 04503-006 figure 21. off isolation v s network analyzer v inx insertion loss = 20log v out v s v dd 10 f v dd 50 v out r l 50 adg936-r rf2x rf1x inx rfcx gnd 50 04503-007 figure 22. insertion loss v s network analyzer v inx crosstalk = 20log v out v s v dd 10 f v dd 50 v out r l 50 adg936-r rf2x rf1x inx rfcx gnd 50 04503-008 figure 23. crosstalk v inx v dd 10 f v dd adg936-r rf2x rf1x inx rfcx nc nc oscilloscope gnd 04503-009 figure 24. video feedthrough
adg936/adg936-r rev. a | page 10 of 16 spectrum analyzer v inx v dd 10 f v dd adg936-r rf2x rf1x inx rfcx gnd 50 combiner rf source rf source 04503-010 figure 25. ip 3 spectrum analyzer v inx v dd 10 f v dd adg936-r rf2x rf1x inx rfcx gnd 50 rf source v s 04503-011 figure 26. p C1 db
adg936/adg936-r rev. a | page 11 of 16 applications the adg936/adg936-r are ideal solutions for low power, high frequency applications. the low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. they can be used in applications such as switchable filters, transmitters and receivers for radar systems, and communication systems from base stations to cell phones. the adg9xx family of wideband switches is designed to meet the demands of devices transmitting at ism band frequencies to 1 ghz and higher. the low insertion loss, high isolation between ports, single pin control interface, no requirement for dc blocking capacitors, and ttl interface compatibility make them cost-effective and easy-to-integrate switching solutions for many high frequency switching and low power applications, because the parts can handle up to 16 dbm of power. absorptive vs. reflective the adg936 is an absorptive (matched) switch with 50 terminated shunt legs; the adg936-r is a reflective switch with 0 terminated shunts to ground. the adg936 absorptive switch has a good vswr on each port, regardless of the switch mode. an absorptive switch should be used when there is a need for a good vswr that is looking into the port but not passing the through-signal to the common port. the adg936 is, therefore, ideal for applications that require minimum reflections back to the rf source. it also ensures that the maximum power is transferred to the load. the adg936-r reflective switch is suitable for applications in which high off-port vswr does not matter. the switch also has some other desired performance features. it can be used in many applications, including high speed filter selection. in most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. filter selection the adg936 and adg936-r can be used to switch high frequency signals between different filters and to multiplex the signal to the output. these dual spdt switches are also ideal for high speed signal routing and for switching high speed differential signals. adg936 adg936 rf1a rf2a rf1b rf2b rf1a rf2a rf1b rf2b rf out rfca rf out rfcb rf in rfcb rf in rfca 04503-013 figure 27. filter selection tx/rx switching the low insertion loss and high isolation between ports ensure that the adg936/adg936-r are suitable transmit/receive switches for all ism band and wireless lan applications, providing the required isolation between the transmit and receive signals. a ntenn a adg936 rf1b rf2b rf1b rf2b rfcb rfca pa lna 04504-014 figure 28. tx/rx switching antenna diversity switch the adg936/adg936-r are ideal for use as antenna diversity switches, switching in different antennas to the tuner. the low insertion loss, which ensures minimum signal loss and high isolation between channels, makes these dual spdt switches suitable for switching applications in tuner modules and set-top boxes.
adg936/adg936-r rev. a | page 12 of 16 evaluation board the adg936 and adg936-r evaluation board allows designers to evaluate these high performance wideband switches with minimal effort. to prove that these devices meet the users requirements, only a power supply and a network analyzer, along with the evaluation board, are required. an application note available with the evaluation board gives complete information on operating the evaluation board. the rfca port is connected through a 50 transmission line to sma connector j3. the rfcb port is connected through a 50 transmission line to sma connector j4. rf1a, rf2a, rf1b, and rf2b are connected through 50 transmission lines to sma connectors j5, j6, j7, and j8, respectively. a through transmission line connects j9 and j10; this transmission line is used to estimate the loss of the pcb over the environmental conditions being evaluated. the board is constructed of a 4-layer fr4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 in. two ground layers with grounded planes provide ground for the rf transmission lines. the transmission lines were designed using a coplanar waveguide with a ground plane model using a trace width of 0.024 in, a clearance to ground plane of 0.008 in, a dielectric thickness of 0.02 in, and a metal thickness of 0.0021 in. 04503-029 figure 29. adg936 and adg936-r evaluation board top view
adg936/adg936-r rev. a | page 13 of 16 outline dimensions compliant to jedec standards mo-153-ac 20 1 11 10 6.40 bsc 4.50 4.40 4.30 pin 1 6.60 6.50 6.40 seating plane 0.15 0.05 0.30 0.19 0.65 bsc 1.20 max 0.20 0.09 0.75 0.60 0.45 8 0 coplanarit y 0.10 figure 30. 20-lead thin shrink small outline package [tssop] (ru-20) dimensions shown in millimeters 1 20 5 6 11 16 15 10 2.25 2.10 sq 1.95 0.75 0.55 0.35 0.30 0.23 0.18 0.50 bsc 12 max 0.20 ref 0.80 max 0.65 typ 0.05 max 0.02 nom 1.00 0.85 0.80 seating plane pin 1 indicato r top view 3.75 bcs sq 4.00 bsc sq coplanarity 0.08 0.60 max 0.60 max 0.25 min compliant to jedec standards mo-220-vggd-1 pin 1 indicator figure 31. 20-lead lead frame chip scale package [lfcsp_vq] 4 mm 4 mm body, very thin quad (cp-20-1) dimensions shown in millimeters
adg936/adg936-r rev. a | page 14 of 16 ordering guide model temperature range package description package option adg936bru C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bru-500rl7 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bru-reel C40c to +85c 20-lead thin sh rink small outline package (tssop) ru-20 adg936bru-reel7 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bruz 1 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bruz-reel 1 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bruz-reel7 1 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bcp C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcp-500rl7 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcp-reel C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcp-reel7 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcpz 1 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcpz-reel 1 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 ADG936BCPZ-REEL7 1 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 eval-adg936eb evaluation board ru-20 adg936bru-r C40c to +85c 20-lead thin sh rink small outline package (tssop) ru-20 adg936bru-r-500rl7 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bru-r-reel C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bru-r-reel7 C40c to +85c 20-lead thin shrink small outline package (tssop) ru-20 adg936bcp-r C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcp-r-500rl7 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcp-r-reel C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 adg936bcp-r-reel7 C40c to +85c 20-lead lead frame chip scale package (lfcsp_vq) cp-20-1 eval-adg936reb eval uation board ru-20 1 z = pb-free part.
adg936/adg936-r rev. a | page 15 of 16 notes
adg936/adg936-r rev. a | page 16 of 16 t notes ? 2005 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d04503C0C8/05(a) ttt

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